Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process
作者: Cai, Chunhua; Tan, Junyan; Hua, Di; 等.
SCIENTIFIC REPORTS   卷: 8     文献号: 17065   出版年: NOV 20 2018
  
Octagon-Shaped 2-D Micromachined Thermal Wind Sensor for High-Accurate Applications
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS   卷: 27   期: 4   页: 739-747   出版年: AUG 2018
  
A 2D Wind Sensor Using the Delta P Thermal Feedback Control
作者: Wang, Shang; Yi, Zhenxiang; Qin, Ming; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS   卷: 27   期: 3   页: 377-379   出版年: JUN 2018
  
EIGHT-TRIGRAM-INSPIRED MEMS THERMAL WIND SENSOR WITH IMPROVED ACCURACY
作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.
会议: 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Belfast, NORTH IRELAND 会议日期: JAN 21-25, 2018
会议赞助商: IEEE
2018 IEEE MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)   丛书: Proceedings IEEE Micro Electro Mechanical Systems   页: 836-839   出版年: 2018
  
Effect of Insulation Trenches on Micromachined Silicon Thermal Wind Sensors
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
IEEE SENSORS JOURNAL   卷: 17   期: 24   页: 8324-8331   出版年: DEC 15 2017
  
Modelling and characterization of a robust, low-power and wide-range thermal wind sensor
作者: Zhu, Yanqing; Qin, Ming; Ye, Yizhou; 等.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS   卷: 23   期: 12   页: 5571-5585   出版年: DEC 2017
  
DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS   卷: 26   期: 5   页: 1073-1081   出版年: OCT 2017
  
Experiment of the MEMS Wind Sensor Based on Temperature-Balanced Mode
作者: Yi, Zhenxiang; Qin, Ming; Huang, Qing-An
IEEE SENSORS JOURNAL   卷: 17   期: 8   页: 2316-2317   出版年: APR 15 2017
  
DRIE TRENCHES AND FULL-BRIDGES DESIGN FOR SENSITIVITY IMPROVEMENT OF MEMS SILICON THERMAL WIND SENSOR
作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.
会议: 30th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Las Vegas, NV 会议日期: JAN 22-26, 2017
会议赞助商: IEEE
30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017)   丛书: Proceedings IEEE Micro Electro Mechanical Systems   页: 985-988   出版年: 2017
  
Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications
作者: Zhu, Yanqing; Qin, Ming; Huang, Jianqiu; 等.
IEEE SENSORS JOURNAL   卷: 16   期: 11   特刊: SI   页: 4300-4308   出版年: JUN 1 2016
  
Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors
作者: Chen, Bei; Zhu, Yan-Qing; Yi, Zhenxiang; 等.
SENSORS   卷: 15   期: 12   页: 29871-29881   出版年: DEC 2015
  
Modeling of Temperature Effects on Micromachined Silicon Thermal Wind Sensors
作者: Huang, Qing-An; Chen, Bei; Zhu, Yan-Qing; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS   卷: 24   期: 6   页: 2033-2039   出版年: DEC 2015
  
Design and implementation of novel thin film position-sensitive detectors (TFPSDs) based on photoconductive effect
作者: Zhu, Yan-qing; Shan, Yuan-yuan; Qin, Ming
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS   卷: 21   期: 9   特刊: SI   页: 1975-1986   出版年: SEP 2015
  
Development of a self-packaged 2D MEMS thermal wind sensor for low power applications
作者: Zhu, Yan-qing; Chen, Bei; Qin, Ming; 等.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING   卷: 25   期: 8     文献号: 085011   出版年: AUG 2015